Syllabus :

Semiconductor IC Technology

Code: EE 511 | L-T-P-C : 3-0-0

Course Contents:

Historical perspective, processing overview, crystal growth, wafer fabrication and basic properties of Silicon Wafers, Clean Rooms, Wafer Cleaning, Epitaxy, Thermal Oxidation of Silicon, Lithography, Wet and Dry Etching, Thin film deposition, Diffusion, Ion Implantation, Metallization, Process Integration: Passive components, Bipolar Technology, MOSFET Technology, MESFET Technology, MEMS Technology, IC Manufacturing: Electrical Testing, Packaging, Yield, Future trends and Challenges: Challenges for integration, system on chip.

Texts / References:

1. G. S. May and S. M. Sze, Fundamentals of Semiconductor Fabrication, Wiley India, 2004.
2. J. D. Plummer, M. D. Deal and P. B. Griffin, Silicon VLSI Technology, Fundamentals, Practice and Modeling, Pearson education, 2000.
3. S. M. Sze, VLSI Technology, 2nd Edn., TMH, 2004.
4. S. M. Sze, Semiconductor Devices: Physics and Technology, 2nd Edn., Wiley India, 2011.
5. W. R. Runyan and K. E. Bean, Semiconductor Integrated Circuit Processing Technology, Addison Wesley Publishing Company, 1990.
6. S. A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press, 1996.
7. M. J. Madou, Fundamentals of Microfabrication, 2nd Edition, CRC Press, 2011.